【mek】B series / T series　Bottom inspection model

Bottom inspection model for wave soldering line

 

Feature

Automation of DIP solder fillet inspection and data management

Improvement of soldering quality

Eliminate the mechanical and human-caused stress of flipping PCB, and improve the long-term reliability.

• Reduce the stress to soldering part of components
• Reduce the stress of chip components on solder surface
  (Approx. 500N weight applied to medium size PCB if it warps 1mm.)

High productivity by simplified production line

Three types of installation ways

Modular type T series can be integrated to bottom or top of conveyer or both sides according to the application.
For example, installation is possible for every process including the bottom inspection of solder joints post soldering or both side inspection of components surface/solder status.

Specifications

Please note that above specification is subject to change without notice.
Please be sure to confirm the updated specification at the time of purchase.