
Data transmission to a PC by USB cable, creating a profile function.
Dedicated software realizes high level of man
Putting it a conveyor to flow through a solder bath to obtain information needed to manage it.
● USB connection to a PC, the dedicated software enables for OK/NG judgment and the management of the test results.
● The created temperature profile makes it possible to monitor the 50ms sampling temperature of the preheat and solder temperature sensors in addition to the conventional management items.
● The heat-resistant cover for high heat load such as Nitrogen oven and etc. is available as an option.
● Equipped with a New Dip Time Sensor, providig a more accurate measurement.
Measurement Data Specifications
Items | Sensor | Display | Measurment range | Accuracy | OK/NG judgement |
Preheat temp. | CA thermocouple | Digital LCD 3-digit | 50 ~ 300 ℃ | ± 1℃ | PC software |
Solder temp | CA sheath thermocouple | 0 ~ 300 ℃ | ± 1℃ | PC software | |
Dip time (1st・2nd) | Electrode (4pcs.) | 0 ~ 10 sec | ± 0.2℃ | PC software | |
Temp. profile | Preheat・Solder temp. | PC software | 0 ~ 300 ℃ | ± 1℃ | – |
※測定精度は熱電対の誤差および基準接点温度の誤差を含みません
General Specifications
Cold contact point compensation | Compensation with platinum temp. measuring resistor |
Heatresistant temp. | 150℃ 5minutes |
Display | LCD |
External connection | USB (mini B connector) |
Number of memories | 1 |
Sampling time | 0.1 s(fix) |
Outer dimensions・Weight | 214(D)mm x 78(W)mm 43.6(H)mm 820g |
Power supply | AAA batteries x 2pcs. (Ni-MH rechargeable battery is also available.) |
The above specifications are subject to change without notice.