The VT-S1080 is the world’s most advanced 3D AOI system, designed for the high-quality manufacturing market. New technologies to overcome the shortfall in production yields traditionally caused by shadow, reflection and cycle-time to realize unmanned inspection process in combination with labor-saving maintenance, using predictive maintenance.
- Fastest cycle-times with high performance 25Mpix Camera.
- Oblique angle inspection with 4-Direction Cameras for those hidden solder joints.
- Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated
- solder shapes.
- Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors
- First Pass Yield efficiency up to 99%.
- Complete Offline Program Generation without Interrupting Production.
- Unique AI for Skill-less labor-saving Program Optimization.
- Unique Global Library to maintain same quality standard across all Production Lines.
- Unique Connection to: Omron Qup Navi: Combine Omron SPI, AOI and AXI Result Data Together for True Root-Cause Analysis.
- Unique Connection to: Omron Qup Opti: Skill-less SPI Setting and Optimisation calculated from AOI Solder Values.
- Unique Connection to: Omron Qup Auto-I: Production Quality Analysis across your Entire Production Line.
- Unique Connection to Omron Qup Auto-C: maintains high quality and high productivity autonomously in your production line.
Hardware configuration / Functional specifications
| Model | VT-S1080-V2.0 | VT-S1040-V2.0 | VT-Z600-V2.0 | |
|---|---|---|---|---|
| Outer dimentions | 1180(W) x 1450(D) x 1500(H)mm (excluding tower lamp and monitor) | |||
| Weight | Approx. 1,240 Kg | |||
| Power supply | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% 50/60Hz | |||
| Rated power | 2.0 kVA (Maximum current 10 A) | |||
| Line height | 900 ±20mm | |||
| Air supply | Not required | |||
| Operating temperature range | 10 ～ 35℃ | |||
| Operating humidity range | 35～80%RH (Non-condensing) | |||
| Camera | Direct | 12 Mpix | ||
| Oblique | 5 Mpix | – | – | |
| Resolution | Direct | 12.5 μm | ||
| Oblique | 10 μm | – | – | |
| FOV | Direct | 52.5 x 52.5 mm | ||
| Oblique | 25.9 x 19.4 mm | – | – | |
| Inspection principle | Hybrid 3DShape reconstruction MDMC*1 illumination + Phase shift (MPS*2) | Hybrid 3DShape reconstruction MDMC*1 illumination + Phase shift (MPS*2 *3) | 2.5D Shape reconstruction MDMC*1 illumination | |
| Supported PCB size | Size | Single lane: 50(W) x 50(D)～510(W) x 680(D)mm Dual lane: 50(W) x 50(D)～510(W) x 330(D)mm | ||
| Thickness | 0.4 ～ 4 mm | |||
| Weight | 4 Kg | |||
| Clearance | Clearance on PCB: 50mm from board surface Clearance under PCB: 50mm from the back of the board (including PCB warpage, deflection, component tolerance, etc.) | |||
| Height measurement range | 25.4 mm | – | ||
| Inspection item | Component height, lift, tilt, missing or wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet*4 (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | Missing or wrong component, wrong polarity, flipped component, OCR inspection, 2Dcode, component offset (X/Y/rotation), fillet (height/ length, end joint width, wetting angle, side joint length)*4, exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge, distance between components, component angle | ||
*1. MDMC：Multi Direction/Multi Color
*2. MPS：Micro Phase Shift
*3. Option
*4. Post-reflow process only