Basic Information
Model name : BESTEM-S500
Die sorter for tray storage compatible with up to 12-inch wafers.
Features
- Equipped with a tray pocket recognition function to improve tray arrangement accuracy
- A visual inspection function exclusively for glass chips (S300 option) enables identification of defects on the front and back sides of glass as well as within it
- Equipped with a needless pickup unit (optional) for compatibility with thin chips
- Compatible with up to 12-inch wafers
Main specs
| Bonding Method | No bonding |
|---|---|
| Bonding Speed | 0.6sec/cycle *Not including processing time |
| Bonding Accuracy | XY: ±38 µm (3 σ) θ: ±0.5° (3 σ) (□2.0 mm or above) ±1.0° (3 σ) (Less than □2.0 mm) |
| Die Size | □1.0-10 mm t: 0.1-1.0 mm |
| Lead frame size (substrate size) | □2” tray, Fluoroware or equivalent: 50.4 mm □3” tray, Fluoroware or equivalent: 76.2 mm □4” tray, Fluoroware or equivalent: 101.6 mm |
| Wafer Size | Max φ12 inch |
| Power requirements | Power requirements: AC200V 30A Dry air: 0.4MPa (60L/min) Vacuum source: -66.7kPa (100L/min) |
| Dimensions | (W) 2,060 × (D) 1,525 × (H) 1,680mm (without signal tower when front cover is closed) |
| Weight | Approximately 1,600 kg |
Options
| Optional Functions | 1. Needleless pickup 2. Glass chip visual inspection function 3. Wafer mapping” |
*1. Device size may vary depending on options.
2. Changes in the quality standards may be requested depending on the specifications of the applicable products.
3. Please note that the specifications are subject to change without notice.