【Yamaha Robotics】Trim & Form System COMBO-300SW

For wider leadframe and higher productivity

リード切断成形装置 COMBO-300SW

Inherits the COMBO model module concept.
This system can handle 300mmL x 100mmW, 8-linematrix frame for higher matrix and larger frame size.

“COMBO-300DC” (250mmL x 80mmW) lineup with die compatibility with the initial A-COMBO model.

Features

  • Continuous molding cycle of 140 spm is achievable by synchronized press operation and unique material handling mechanism.
  • Each function is modularized to accommodate the multifunctional front and rear processes of semiconductor manufacturing.
  • The system can be easily reconfigured and added after delivery.
  • In the trim & forming area of the machine, a full-open function is provided for the press mechanism used to drive the machine, making it easy to perform mold maintenance.

Option support

  • Image processing/supply frame confirmation (supply direction, different frame discrimination)
  • Detection of two frames stacked each other (at Feeding section with checking for feeding errors)
  • Ejection of different frames (at supply side, removal of NG products for visual inspection)
  • Area sensor at press unit (to ensure safety inside the mold access door)
  • Shot counter (shot management for each die)
  • Support for additional function modules (press unit addition, vision module addition, etc.)
  • Visual inspection / blade breakage detection
  • Undercut inspection (detection of foreign object damage in die)
  • Visual inspection/forming lead inspection *Addition of functional module

Product Specifications

 D/DT/F
Index speed*140SPM70SPM
System size(W)1,938 × (D)1,170 × (H)1,850mm(W)2,720 × (D)1,429 × (H)1,850mm
System weightApprox. 2,000kgApprox. 2,500kg
Conversion TimeApprox. 15min.Approx. 30min.
Main system
configuration
2 stack magazine loader2 stack magazine loader
1 head power module1 head power module
2 stack magazine off-loaderJEDEC tray off-loader
LeadframesWidth: 40~100mm Length: 180~300mm Thickness: 0.1~0.25mm
Unit-Column Pitch: 8~55mm Side Rail Width: Min. 2.5mm
Package Size: (7 X 7)~(32 X 32)mm Number of Rows: Max. 8
Leadframe Based Package Families excluding J-Bend, DIP and QFN.
MagazinesC-Type Open stack magazine
Width: 44~104 mm Length: 184~304 mm Height: 210~455mm
TraysJEDEC Std. Plastic Hard Trays
Pocket Pitch (X&Y): Min. 8mm
Noise levelMax. 80dB
OptionsImage processing / Supply frame confirmation
(supply direction, different frame identification)
Double-Strip Check (On-loader)
Wrong Strip Reject
Press Safety Beam Sensor
Shot Counter
Support for additional function modules
(additional presses, additional vision modules, etc.)
Image inspection/blade breakage detection
Bottom dead inspection output
(detection of foreign object damage in die set)
Image inspection/Forming lead inspection *Additional function module

* The index speed is subject to vary according to the product.
Specifications and appearance are subject to change without notice for improvement or enhancement.

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