High speed and High Precision Die Bonder for Small Chips with Eutectic, WBC/DAF* and Epoxy Bonding Process Capabilities One type of die bonder. A high-speed die bonder for small signal transistors, diodes, and other small sized dies. A die is picked up from a wafer and directly bonded onto a lead frame in a thermal eutectic manner. The machine automatically detects reject identification marks and large chipping on dies in a wafer sheet, and picks up only the good dies. Lead frames are fed from the lead frame stack loader and unloaded to the unloader magazine after bonding.
Features
- Bonding accuracy ±20μm (3σ) (option: ±15um (3σ))
- 10% increase in UPH compared with conventional models
- High precision lead frame indexing utilizing linear drive
- Capable of handling 86mm width lead frames for bonding up to 76mm Y axis bonding area (for thermo-eutectic bonding)
- Capable of handling various device conditions (with parameter settings for wafer tape expansion amount, and zoom function for die recognition camera)
- Capable of handling epoxy bonding (with dual bonding heads) by installing epoxy unit
- Capable of handling 100mm width and 300mm length lead frames with universal indexer (for paste dispensing method)
- Additional higher accuracy and various inspection functions available with die backside camera (option)
- Conversion kit available for eutectic, WBC/DAF*, and epoxy processes
*WBC/DAF : Wafer Backside Coating / Die Attach Film
Product Specifications
| ITEM | DETAILS |
|---|---|
| Product Name | Die Bonder |
| Model | STC-800 |
| Bonding Method | Thermo – eutectic, paste dispensing, and thermo compression bonding methods |
| Bonding Accuracy | Standard XY : ±20μm (3σ), θ : ±3°(3σ) based on bonding conditions at Shinkawa High precision XY : ±15μm (3σ), θ : ±3° (3σ) based on bonding conditions at Shinkawa |
| Machine Cycle Time | 0.140s / chip (at Y=40mm) Average based on bonding conditions at Shinkawa 0.168s / chip UPH 21,400 |
| Lead Frame Indexer Setting Temperature | Fixed indexer : RT – 500°C (3ch control) Universal indexer : RT (option : RT – 200°C) |
| Lead Frame Indexing | Fixed indexer with pin transfer system (for thermo – eutectic and thermo compression bonding) Universal indexer with grip transfer system (for paste dispensing and thermo compression bonding) |
| Wafer Tape Expansion Amount | 5～15mm(variable) |
| Chip Size | □0.12 – 1.5mm (for thermo – eutectic and thermo compression bonding) □0.3 – 3.0mm (for paste dispensing and thermo compression bonding) |
| Wafer Size | Maximum 8-inch |
| Workpiece Size | Width 20 – 86mm (maximum bonding area ＝ 76mm) for thermo – eutectic bonding 30 – 100mm (maximum bonding area ＝ 90mm) for paste dispensing and thermo compression bonding Length 120 – 260mm (maximum bonding area ＝ 10mm) for thermo – eutectic bonding 100 – 300mm (maximum bonding area ＝ 10mm) for paste dispensing and thermo compression bonding Thickness 0.1～0.4ｍｍ |
| Options Available | Magazine loader stocker type, die backside detecting function |
| Utilities | Input Power Supply Single phase AC 200V±5% 50/60Hz (Other power supply options available on request) Power Consumption Maximum 2.23kVA (2.0kW) for thermo – eutectic bonding Maximum 0.93kVA (0.78kW) for paste dispensing method Air 400kPa (4kgf/cm2) 250L/min Connection : φ8 Tube 2 spots N2 Gas 200kPa (2kgf/cm2) 10L/min Connection : φ6 Tube 1 spot Forming Gas N2 95% + H2 5% (only for thermo – eutectic bonding) Vacuum Below -87kPa (-650mmHg) (gage) Connection : φ8 Tube 1 spot |
| Physical Dimensions and Mass | Approx. 1,115Ｗ × 1,130Ｄ × 2,110Ｈ ｍｍ Approx. 1,160kg (excludes monitor display and signal tower) |
※Configuration and specifications of this machine are subject to partial modification without prior notice.