【YAMAHA】3D High-speed Solder Paste Inspection Machine YSi-SP
Feature
- “1-head solution” to perform various inspections with a single head
- Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
- A thorough and extensive machine-to-machine (M2M) solution
- Statistical Process Control (SPC) for diverse statistical processing
- Optional features to enable handling various products
基本仕様
| Applicable PCB | L510×W460mm～L50×W50mm (single lane spec) *No dual lane specification available. |
|---|---|
| Horizontal resolution (FOV size) | 1) 25μm / 12.5μm / 8.5μm (approx. 50 x 50mm) 2) 20μm / 10μm / 7μm (approx. 40 x 50mm) 3) 15μm / 7.5μm / 5μm (approx. 30 x 30mm) Note : All are standard selection type. |
| Height resolution | 1µm |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) |
| Power supply | Single-phase AC 200V–230V ±10% |
| Air supply source | Airless specification |
| External dimension | L904×W1,080×H1,478 mm |
| Weight | Approx. 550 kg |
Specifications and appearance are subject to change without prior notice.