Yamaha proprietary hybrid placer, best suitable for module device, that consists of semiconductor and SMD.
Feature
- Hybrid mounting
Realize mixed mounting of semiconductor and SMD - High-speed and high-accuracy mounting
±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions - Upgraded component supply
Intelligent feeder - Handling Large PCBs
L330 x W250mm
Specifications
| Applicable PCB | L50 x W30mm to L330 x W250mm | |
|---|---|---|
| PCB thickness | 0.1 to 4.0mm | |
| PCB conveyance direction | Left ⇒ Right (option : Right ⇒ Left) | |
| Conveyer reference | Front | |
| Mounting accuracy (Cpk≧1.0) | ±15μm | |
| Mounting capability | 10,800 CPH (when die is supplied from wafer) Note : under optimum conditions | |
| Number of component types | Reel : Max. 48 types (conversion for 8mm tape feeder) Wafer : Max. 10 types | |
| Die | Die size | □0.35 to □16mm Note |
| Die thickness | 0.1 to 0.5mm Note | |
| Wafer size | 6 to 8 inch wafers, 2 to 4 inch waffle trays | |
| Wafer magazine | Wafer : Max. 10 types | |
| SMD | Component size | 0201 to □16mm, H15mm (multi camera) 0201 to □12mm, H6.5mm (scan camera) |
| Tape size | 8 to 104mm | |
| Max feeder count | Max. 48 types (for 8mm feeder) | |
| Power supply | 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz | |
| Air supply source | 0.45 MPa or more, in clean, dry state | |
| External dimension | L1,252 x W1,962 x H1,853mm | |
| Weight | Approx. 1,560kg | |
Note : The minimum size should be checked on an actual machine.
Specifications and appearance are subject to change without prior notice.